31 MSI - (Marvell Semiconductor Inc.) US · Santa Clara, CA

Link Layer architect at 31 MSI - (Marvell Semiconductor Inc.) US — Santa Clara, CA

Full-timeSanta Clara, CAPosted 2026-07-20Apply on Workday

Full job description

About Marvell

Your Team, Your Impact

Marvell’s Compute and Custom Solutions organization (CCS) is looking for a talented senior ASIC link layer architect to join our architecture team. This team acts as the central technical interface to our datacenter clients. It is responsible for the overall technology choice, silicon partitioning strategy, IP definition and selection and architectural guidance of datacenter products (SmartNIC, servers, AI accelerators and switches, mainly) for the main hyperscalers and companies worldwide. We actively participate in the definition of next generation datacenter products with our clients and respond to their ASIC RFQs. Role spans engagement with both customers and internal technology teams to define the best solution to the custom product needs and includes all functions required to build, test and manufacture an advanced custom silicon System in a Package.

What You Can Expect

We are seeking a senior Link Layer Architect to own the end-to-end architecture of link layer solutions across high-speed interconnect protocols including Ethernet, Custom link-layers and Die-to-Die (D2D) interfaces.

This role offers the opportunity to shape the future of high-speed interconnect technologies at Marvell, engaging with customers to enable next-generation computing and communication systems as an integral part of the Custom Solutions Architecture team.

Architecture & Technical Leadership

  • Define and develop link layer architectures for various high-speed interconnects (Ethernet and custom link-layers)
  • Drive link layer architecture in the context of full-system performance, power, reliability and scalability goals
  • Create architectural specifications and design documents for link layer protocols and implementations
  • Drive technical decisions on link layer features including error correction, flow control, retry mechanisms, and data integrity
  • Evaluate and recommend new link layer technologies and standards for next-generation products and custom solutions
  • Lead architecture reviews and provide technical guidance to cross-functional teams

System Integration & Optimization

  • Define interfaces between link layer, transaction layer, and physical layer
  • Optimize link efficiency, latency, and bandwidth utilization

Standards & Industry Engagement

  • Stay current with emerging link layer standards and technologies
  • Contribute to specification development and review
  • Ensure compliance with industry standards and specifications

Cross-Functional Collaboration

  • Engage directly with customers on architecture discussions, including requirements definition, architectural alignment, and design trade-offs
  • Work closely with PHY architects, system architects, and ASIC design teams
  • Partner with verification teams to define test plans and coverage strategies
  • Support hardware bring-up and validation teams with technical expertise

Innovation & Technology Development

  • Research and evaluate new link layer technologies and approaches
  • Develop proof-of-concept implementations for novel link layer features
  • Create reusable IP blocks and architectural frameworks
  • Drive continuous improvement in link layer performance and reliability

Documentation & Knowledge Sharing

  • Create comprehensive architecture specifications and design documentation
  • Develop datasheets, integration guides, and reference designs
  • Present technical concepts to internal teams and external customers
  • Mentor engineers and share link layer expertise across the organization

What We're Looking For

Technical Expertise

  • Extensive experience (typically 10+ years) in link-layer design and architecture
  • Deep understanding of Ethernet link layer IEEE 802.3 (100G and 200G)
  • Strong knowledge of link layer protocols, error detection/correction, and reliability mechanisms
  • Experience with FEC implementations (Reed-Solomon, Hamming, BCH, etc.)
  • Understanding of link training, equalization, and physical layer interaction

Architecture Skills

  • Proven track record of defining successful system architectures
  • Experience guiding RTL design and verification, including design reviews and architectural trade-offs (hands-on experience a plus)
  • Understanding of SerDes/PHY interfaces and requirements

Communication & Leadership

  • Excellent written and verbal communication skills
  • Ability to present complex technical concepts to diverse audiences
  • Experience leading cross-functional technical initiatives
  • Strong problem-solving and analytical capabilities

Preferred Qualifications

  • MS or PhD in Electrical Engineering, Computer Engineering, or related field
  • Experience with chiplet architectures and advanced packaging
  • Prior involvement in industry standards organizations
  • Knowledge of network protocol stacks and system architecture

Key Competencies

  • Strategic thinking and long-term technology planning
  • Innovation and creative problem-solving
  • Collaborative and team-oriented approach
  • Customer focus and business acumen
  • Adaptability to emerging technologies
  • Attention to detail and quality

Expected Base Pay Range (USD)

191,530 - 286,900, $ per annum

Interview Integrity

#LI-TT1