100 Intel Corporation · US, OR

Senior Testchip SoC Physical Design Engineer (Integration & Methodology) — US, OR

Full-timeUS, ORPosted 2026-07-20Apply on Workday

Full job description

# Job Details:

## Job Description:

About the Role

Join the Design Technology Platform (DTP) organization within Intel Foundry as part of the X-Chip SoC Full-Chip Integration team. This team plays a critical role in enabling next-generation semiconductor innovation by delivering testchip platforms that validate advanced process technologies and support high-volume manufacturing readiness.

In this role, you will contribute to the development of physical design methodologies and drive full-chip SoC integration for cutting-edge testchip vehicles. You will collaborate across design, process, and manufacturing teams to ensure high-quality, scalable solutions for advanced technology nodes.

What You’ll Do

Key responsibilities will include but not limited to:

  • Developing layout design methodology for testchip development in next generation process nodes
  • Working closely with Process Integration, Yield and QnR to define critical Design features that need to be exercised in the early lead vehicle test chips.
  • Establishing, orchestrating, overseeing, and maintaining hierarchical layout design specifications for correct-by-construction integration
  • Building and executing tactical plans to converge hierarchical SOC layout design against aggressive schedule requirements by working closely with PDK teams
  • Driving all aspects of physical design convergence, including preparing layout hierarchy for design tape-in, debugging and resolving issues uncovered by verification tools
  • Working with tool/flow owners and vendors for ongoing tool/methodology improvement

Behavioral traits that we are looking for:

  • Exhibiting strong interest in Layout design in advanced technology nodes.
  • Strong verbal and written communication skills
  • Ability to work well both autonomously and in an intensive, cooperative team environment
  • Coordinate between different stakeholders for testchip to arrive at execution commit for testchip
  • Motivation to continuously learn and drive to push improved layout productivity and efficiency

Why Join Us

  • Work on cutting-edge semiconductor technologies that shape the future of computing
  • Collaborate with industry-leading experts across design and manufacturing
  • Opportunities for career growth and technical leadership
  • Contribute to innovations that impact global technology at scale
  • Intel invests in our people and offers a complete and competitive package of benefits employees and their families through every stage of life

See Intel Benefits for more details.

## Qualifications:

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Note:

For information on Intel’s immigration sponsorship guidelines, please see

Intel U.S. Immigration Sponsorship Information

Minimum Qualifications and Experience:

Master's degree in electrical engineering or related field with minimum of 5 years of experience in the following areas:

  • Experience with physical/layout design in advance technology nodes
  • In Layout design tools like Cadence Virtuoso Suite or Synopsys Custom Compiler
  • Design rules and layout constraints in advanced semiconductor processes
  • Experience with floorplanning, hierarchical design integration, and layout verification/debug

Preferred Qualifications and Experience:

  • Experience in Definition of Testchip/Product design from Concept to Execution Commit
  • Experience in working with Foundry teams on negotiating features to exercise in design
  • Proven Project Management skills on coordinating and tracking the entire design cycle of a project from Feature definition to final Tape-in
  • Previous related work experience in a semiconductor foundry preferred

## Job Type:

Experienced Hire

## Shift:

Shift 1 (United States of America)

## Primary Location:

US, Oregon, Hillsboro

## Additional Locations:

US, California, Santa Clara, US, Texas, Austin

## Posting Statement:

## Position of Trust

N/A

## Benefits

Annual Salary Range for jobs which could be performed in the US: $141,910.00-200,340.00 USD

Work Model for this Role

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