Engineering Technician / Micro-Electronic Wire Bonder Technician — US - Lewisburg, TN

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Job Description

Under close to moderate supervision, performs a wide range of electronic, micro-electronic, and electro-mechanical assembly and technical support tasks. Responsibilities include building and assembling units such as printed circuit assemblies (PCAs), modules, and subassemblies, as well as performing precision micro-electronics work including wire bonding under a microscope. This role supports production and engineering by executing assembly processes, assisting with troubleshooting, and ensuring product quality, reliability, and compliance with established manufacturing standards.

## Key Responsibilities-other duties as assigned.

• Assemble electronic and electro-mechanical subassemblies following production drawings, work instructions, and engineering documentation.
• Perform precision micro-electronics assembly, including wire bonding operations (ball and wedge bonding) using specialized bonding equipment under a microscope.
• Interpret schematics, wiring diagrams, bills of material (BOMs), and manufacturing instructions to determine required components and processes.
• Install and connect electronic components onto PCBs and substrates.
• Perform soldering and de-soldering on through-hole and surface-mount components.
• Set up, operate, and maintain wire bonding equipment, ensuring proper bond integrity.
• Inspect wire bonds and micro-electronic assemblies using microscopes and measurement tools.
• Perform rework, repair, and troubleshooting of assemblies.
• Support engineering activities including process improvements and documentation updates.
• Use hand tools, microscopes, jigs, and fixtures to assemble and secure components.
• Perform epoxy application, encapsulation, curing, and cleaning processes.
• Conduct in-process inspections and visual checks to ensure quality standards are met.
• Maintain accurate production records and documentation.
• Follow all safety and ESD procedures.
• Maintain a clean and organized work environment.

## Requirements

• High school diploma or equivalent required; technical training preferred.
• 0–3 years of experience in electronic assembly, micro-electronics, or wire bonding.
• Experience with microscope work and fine motor skills required.
• Basic understanding of electronic components and schematics.
• Ability to perform soldering and micro-assembly tasks to standard
• Familiarity with ESD controls and IPC standards preferred.
• Strong attention to detail and ability to work with small components.
• Ability to follow detailed instructions and procedures.
• Basic troubleshooting skills.
• Good manual dexterity and hand-eye coordination.
• Ability to work effectively in a team environment.