System Mechanical & Integration Engineer at 1010 Analog Devices Inc. — US, MA

About Analog Devices

# System Mechanical & Integration Engineer

Wilmington, MA

Position Overview

Analog Devices’ High Voltage & Protection team is seeking a Systems Integration Engineer to support the development of next-generation data center power delivery solutions.

In this role, you will work alongside experienced power electronics, thermal, mechanical, systems, and reliability engineers to design, integrate, and validate high-density power supply systems for AI and cloud computing infrastructure. The focus will be on mechanical architecture development, thermal management, enclosure design, busbar integration, manufacturability, and system-level validation of high-power server and rack-level power solutions.

Key Responsibilities

In this role, your focus will be on hands-on mechanical and thermal development of power systems, with ownership commensurate with level and increasing responsibility over time.

• Design and integrate mechanical subsystems for high voltage power conversion platforms, including HV DC/DC module, intelligent power system, and Power Distribution Box (PDB).
• Own enclosure and structural design activities, including sheet metal design, die-cast components, machined parts, fastening strategies, tolerance stack-up analysis, manufacturability, and assembly considerations.
• Develop thermal solutions for high-power electronic systems utilizing air cooling, liquid cooling, cold plates, heat sinks, vapor chambers, heat spreaders, and advanced thermal interface materials.
• Perform thermal simulations and airflow analysis using industry-standard tools (Icepak, Fluent, 6SigmaET, FloTHERM, Star-CCM+, or equivalent) to optimize cooling performance and maintain component reliability.
• Design and validate power interconnect solutions including busbars, copper current-carrying structures, high-current connectors, grounding systems, and electrical isolation features.
• Collaborate closely with electrical and power electronics teams to optimize mechanical packaging of transformers, inductors, capacitors, semiconductors, and magnetic components.
• Create and execute thermal, mechanical, vibration, shock, and environmental validation plans to ensure compliance with product and customer requirements.
• Support prototype builds, design verification testing (DVT), and root-cause analysis of thermal, structural, or assembly-related issues.
• Work with manufacturing partners, suppliers, and contract manufacturers to develop cost-effective, scalable, and production-ready mechanical solutions.
• Document system architecture, design analyses, simulations, test results, and lessons learned to support product development and continuous improvement.

Required Qualifications

• MS or PhD in Mechanical Engineering, Thermal Engineering, Aerospace Engineering, Electrical Engineering, or a related field.
• 3+ experience with Strong foundation in multiple areas spanning:
• Mechanical design and product development
• Thermal management of electronic systems
• System integration of power electronics platforms
• Candidates with additional experience may be considered at the Senior Engineer level
• Demonstrated experience (research, projects, internships, or industry) developing mechanical and thermal solutions for electronic products, power systems, or high-performance computing infrastructure.
• Experience with CAD tools such as Creo, SolidWorks, NX, or CATIA.
• Experience performing thermal simulations, CFD analysis, or airflow optimization for electronics cooling applications.
• Understanding of structural mechanics, tolerance analysis, material selection, and manufacturing processes.
• Knowledge of high-current power distribution methods including busbars, connectors, grounding, creepage, and clearance requirements.
• Strong analytical and problem-solving skills with a hands-on approach to design validation and troubleshooting.

Preferred Qualifications

• Industry experience with data center power supplies, server platforms, rack-level power systems, renewable energy, or energy storage systems.
• Experience designing high-power systems (>3 kW), power shelves, >400V power conversion platforms, or AI infrastructure hardware.
• Proficiency with thermal simulation tools such as ANSYS Icepak, Fluent, FloTHERM, 6SigmaET, or Star-CCM+.
• Experience with liquid-cooling technologies including cold plates, CDU integration, direct-to-chip cooling, and rack-level thermal management.
• Knowledge of power electronics packaging including magnetic components, power semiconductors, busbar design, and EMC/EMI considerations.
• Familiarity with mechanical reliability testing including vibration, shock, HALT/HASS, and environmental qualification.
• Experience with DFM, DFA, FMEA, GD&T, tolerance stack-up, and production release processes.
• Python or MATLAB experience for thermal data analysis, automation, and model correlation.
• Strong communication skills and ability to work effectively in multidisciplinary engineering teams.

Job Req Type: Experienced

Required Travel: Yes, 10% of the time

Shift Type: 1st Shift/Days

The expected wage range for a new hire into this position is $110,385 to $151,808.

• Actual wage offered may vary depending on work location, experience, education, training, external market data, internal pay equity, or other bona fide factors.
• This position qualifies for a discretionary performance-based bonus which is based on personal and company factors.
• This position includes medical, vision and dental coverage, 401k, paid vacation, holidays, and sick time, and other benefits.