Principal Package Design Engineer at Renesas Electronics — Tempe, AZ

Renesas is seeking a Principal Package Design Engineer to support advanced package technology development for commercial space, aerospace, and high-reliability power applications. This role will focus on hermetic, ceramic, metal, radiation-tolerant, and Class P plastic packaging solutions, working closely with product design, reliability, OSAT partners, in-house assembly teams, and key package suppliers to define, develop, qualify, and optimize package technologies for demanding high-reliability environments.

Responsibilities

• Develop hermetic, ceramic, metal, radiation-tolerant, and Class P plastic package technologies and interconnect methods for commercial space, aerospace, and high-reliability power applications.
• Define package technology requirements, tooling needs, process flows, and qualification plans for new and existing package platforms.
• Benchmark, select, and qualify materials, assembly processes, and subcontractors, including OSAT partners and Renesas’ in-house Palm Bay assembly site.
• Partner with Renesas product design teams to develop detailed package drawings for hermetic and plastic packages using AutoCAD.
• Work with OSAT partners and internal manufacturing teams to run DOE activities, optimize assembly processes, and establish process specifications.
• Collaborate with product engineering, program management, and reliability teams to qualify new packages and processes within required project schedules.
• Maintain technical expertise on advances in hermetic, ceramic, metal, radiation-tolerant, and Class P plastic packaging technologies.
• Participate in packaging roadmap development, with a focus on execution, manufacturability, reliability, and long-term package strategy.
• 10+ years of relevant experience in semiconductor package development, with emphasis on hermetic, ceramic, metal, radiation-tolerant, or Class P plastic packaging.
• Experience with semiconductor IC assembly processes, materials, package technologies, and package qualification.
• Familiarity with high-reliability, aerospace, commercial space, or defense-related semiconductor packaging requirements.
• Experience working with external package suppliers, OSAT partners, or internal assembly/manufacturing sites.
• Knowledge of AutoCAD and Microsoft Office tools, including Excel, PowerPoint, and Word.
• Strong communication, analytical, presentation, and cross-functional collaboration skills.
• Familiarity with MIL-STD-883, MIL-PRF-38535, and MIL-STD-750 standards.

Education

• Bachelor’s, Master’s, or Doctorate degree in Physics, Chemistry, Mechanical Engineering, Electrical Engineering, Materials Engineering, or a related technical field.
• Masters Preferred