Lead Thermal Design Engineer at Jabil Inc. — Austin, TX

JOB SUMMARY

The Thermal Engineer is responsible for leading thermal architecture, analysis, and validation activities across complex hardware platforms. This role drives cooling strategy, owns thermal risk management, and ensures products achieve performance and reliability targets through disciplined simulation, testing, and cross-functional problem solving.

ESSENTIAL DUTIES AND RESPONSIBILITIES

• Lead thermal design strategy for platform cooling systems, including airflow architecture, heatsink solutions, fan strategy, and thermal control considerations.
• Own advanced thermal simulation and analysis activities to validate design direction and system layout performance.
• Define thermal validation scope, plans, schedules, and acceptance criteria aligned to product and customer requirements.
• Drive root cause analysis and corrective actions for thermal issues found during design, validation, builds, or field feedback loops.
• Identify thermal risks early, develop mitigation and contingency plans, and communicate trigger conditions and closure plans to stakeholders.
• Partner with Mechanical, Electrical, Firmware, Systems, and Validation teams to ensure cross-functional decisions support reliable thermal performance.
• Publish clear thermal performance reports, gap assessments, and status updates that enable timely program decisions.
• Mentor junior engineers and contribute to thermal methodology, standards, and best practice development.

JOB QUALIFICATIONS

Education & Experience

• Bachelor’s degree in Mechanical Engineering, Thermal Engineering, or related technical field; Master’s degree preferred.
• 5–10 years of relevant experience in thermal design, cooling architecture, analysis, and validation of complex hardware systems.

Knowledge, Skills, and Abilities

• Strong expertise in CFD or equivalent thermal modeling techniques and interpretation of system-level thermal behavior.
• Experience defining and executing thermal validation plans and driving technical issue closure across product programs.
• Familiarity with server, storage, networking, AI infrastructure, or other high-power electronics products is required.
• Strong analytical skills and ability to communicate technical risk, data, and recommendations clearly.
• Demonstrated ability to lead technical efforts across matrixed, cross-functional engineering teams.

Accessibility Accommodation

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